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系統整合 |
- 流線式生產和工作單元式生產
(Flow-line
and
workcell
line
types) |
| - 接單後生產
(Build-to-order,
BTO)
|
| - 客製化生產
(Configure-to-order,
CTO) |
| ·
PCB組裝 |
| - 晶片尺寸封裝
(Chip-scale
packaging,
CSP) |
| - 覆晶封裝技術
(Flip
chip
technology) |
| - 無鉛製程
(Lead-free
process) |
| - 氮氣迴銲爐
(N2
Reflow) |
| - 柵格陣列式球狀接點零件封裝
(Ball
Grid
Array,
BGA) |
- 微小柵格陣列式球狀接點零件封裝
(Micro
ball
grid
array,
MBGA) |
- 免洗雙面表面黏著式封裝製程和波焊製程
(No-clean
double
side
SMT
and
Wave
solder
process) |
| - 插件式波焊製程 (Wave
solder
process) |
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| · 擴大客戶模擬稽核 (Extended
Customer
Simulation
Audit,
XCSA) |
| · 拆箱檢驗
(Out-of-box
audit,
OOBA) |
· 故障模式分析/失效模式分析
(Failure
effects
mode
analysis,
FMEA) |
| · 全面品質管理
(Total
quality
management,
TQM) |
| · 持續可靠度測試
(On-going
reliability
test,
ORT) |
| · 設計品質保証
(Design
quality
assurance,
DQA) |
| · 設計確認測試
(Design
verification
testing,
DVT) |
| · 製造驗證測試
(Manufacturing
verification
testing,
MVT) |
| · 品質確認測試
(Quality
verification
testing,
QVT) |
| · 供應商品質保証
(Supplier
quality
assurance,
SQA) |
| · 持續性改進計劃
(Continuous
improvement
program,
CIP) |
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基板PCB測試
(PCB
test) |
| ·
線路靜態測試
(In-circuit
tester,
ICT) |
| ·
自動檢測裝備
(Auto
test
equipment,
ATE) |
| ·
飛針式線路靜態測試
(Fly
probe
in-circuit
tester) |
| ·
自動X光檢驗(Automated
x-ray
inspection,
AXI) |
·
自動光學檢驗
(Automated
optical
inspection,
AOI)
 Video
|
| ·
功能性測試
(Functional
test) |
| ·
系統整合測試
(System
integration
test) |
| ·
運轉測試
(Run-in
test) |
| ·
無線與通訊
(Wireless
&
Telecom) |
| ·
傳輸測試
(Communication
Test)
|
| ·
多重軟體平台
(Multiple
S/W
platform) |
| ·
環境壓力監控
(Environmental
stress
screening,
ESS) |
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